8 Layers Printed Circuit Boards with BGA

8 Layers Printed Circuit Boards with BGA de Agile Circuit Co., Ltd

Por: Agile Circuit Co., Ltd  27/03/2011
Palavras-chave: Eletrônicas, Circuito Impresso, Circuitos Eletrônicos

   1.8 Layers Printed Circuit Boards with BGA  2. Fast Quotation, cost aggressive 3. No MOQ, Prototype available 4. ISO/TS approved facilities   1) Layer count: Single Layer, Double sided, Multi-Layers up to 26 Layers 2) Board finished thickness: 0.2mm, 1.0mm, 1.6mm, 2.0mm to 4.0 mm 3) Material: FR-4, CEM-1,CEM-3, High Tg, High Frequency, Aluminum Base 4) Copper thickness: 0.5oz, 1oz, 2oz,3oz,4oz 5) Conductor width and space: 3mil/3mil 6) Surface treatment: HASL, Lead-free HASL, OSP/ENTERK, Immersion Gold/Tin/Silver 7) Solder Mask /Resist: LPI Green, Red, Yellow, Black, White, Blue 8) Profiling: Punching, Routing, V-Cut, Beveling 9)Special Requirement: BGA,HDI ,Impendence Control, Gold Finger, Blind & Buried Via holes, Carbon Ink Printing, Peelable Mask, Countersink, Back Panel  

Palavras-chave: Circuito Impresso, Circuitos Eletrônicos, Comercio De Componentes Eletronicos, Eletrônicas, FR4 Placas de Circuito Impresso, Multi Layer Boards, Placa De Circuito Impresso, Placas De Circuito Impresso, Printed Wire Boards, PWB de alumínio,

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